Gas SolderingGas soldering with soft solders use a mixture of fuel gases and either oxygen or air to raise the temperature of a component to a temperature at which the solder can melt and flow into the joint by capillary action. Solders are low temperature materials with a melting point below 450°C. Copper pipework is commonly joined by using soft solder, a favorite technique is to use connectors that already contain a soft solder ring dispensing with the need to add extra filler. There are a number of assembly processes where a low heat input and low strength are needed these can be completed by using soft solder. Filler metals contain 63% tin and 37% lead are the most widely used and will give a melting point of below 200°C, but for higher strength applications filler metals containing silver, copper or cadmium are available. In all cases a suitable flux must be used.
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